Bill Gatliff <[email protected]> wrote: > The latest generation of BGA parts have so many pins on the package, > packed so tightly together, that it isn't possible to get all the > signals out of the chip in two layers and still have the traces large > enough to meet specs. > [...] > I'm told that the OMAP3430's Package-on-Package configuration > requires at least six layers to get all the signals out. Ugh.
OK, that explains the need for a lot of layers. But how does the need for blind/buried vias arise? MS _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
