> I think a side benefit of blind vias, (one side exposed on surface), is they > can't wick much solder away > from a BGA ball. Is that current practice anyone?
did you mean if vias were directly under the balls? Normally BGAs are 'dog boned' (a track comes off each ball to a via in between the balls), I believe this stops the wicking as the vias are covered with solder resist. The bottom left pic in the linked image is the only example that google provided me: http://wiki.altium.com/download/attachments/5276308/EscapeRoutes.png _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
