Bill Gatliff wrote: > I haven't come across a situation that required a buried via, so I can't > comment on that. Can't even guess, actually.
That's just a via that has no top or bottom layer impact, only the ones between the layers it connects are consumed. One benefit is the pad stack can be smaller for internal layers making it a smaller transmission line anomaly. Other benefit is parts or traces on the surface don't stop routing underneath them so you can make the highest density PCB with buried vias. I think a side benefit of blind vias, (one side exposed on surface), is they can't wick much solder away from a BGA ball. Is that current practice anyone? Buried vias allow more than one via in the same vertical zone possibly -- not sure? John G _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
