On Tue, Jun 26, 2012 at 12:32:33AM +0200, Samuel Lesueur wrote: > Anyway, I am currently designing an open source 300W DC motor controller > and I need a huge amount of vias to handle the current flow from the top > layer > where my MOSFET transistors are installed to the bottom and its huge GND > zone.
At last a fellow power designer :D I vote yes for bottom side cooling... The idea is very interesting since I had the same problem (I solved putting the vias as pad in the fet package... as an extra it gives you untented vias which have better thermal performance). I've only a doubt... do these via 'survive' the track cleanup? -- Lorenzo Marcantonio Logos Srl _______________________________________________ Mailing list: https://launchpad.net/~kicad-developers Post to : [email protected] Unsubscribe : https://launchpad.net/~kicad-developers More help : https://help.launchpad.net/ListHelp
