Hi Samuel, I also had the same problem recently (making a high power led controller 3x8A channels), and people complain from time to time about this issue,
I'd be willing to see this working, but as far as I know there are many issues to take care of: cleanup code (as lorenzo said), clearance, etc. I have very little experience on this area, but.. Jean Pierre, Wayne, what are the standard problems that he may check for? 2012/6/26 Lorenzo Marcantonio <[email protected]> > On Tue, Jun 26, 2012 at 12:32:33AM +0200, Samuel Lesueur wrote: > > > Anyway, I am currently designing an open source 300W DC motor controller > > and I need a huge amount of vias to handle the current flow from the top > layer > > where my MOSFET transistors are installed to the bottom and its huge GND > zone. > > At last a fellow power designer :D I vote yes for bottom side cooling... > > The idea is very interesting since I had the same problem (I solved > putting the vias as pad in the fet package... as an extra it gives you > untented vias which have better thermal performance). > > I've only a doubt... do these via 'survive' the track cleanup? > > -- > Lorenzo Marcantonio > Logos Srl > > _______________________________________________ > Mailing list: https://launchpad.net/~kicad-developers > Post to : [email protected] > Unsubscribe : https://launchpad.net/~kicad-developers > More help : https://help.launchpad.net/ListHelp > -- Miguel Angel Ajo Pelayo http://www.nbee.es +34 636 52 25 69 skype: ajoajoajo
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