I forgot to mention that the other side was filled with potting compound loaded with silica to equalize the heat. The heatsink was the box for the whole circuit.
Jean-Paul AC9GH On Jun 6, 2014, at 4:08 PM, Jean-Paul Louis <[email protected]> wrote: > The bottom was glued with thermal glue to a large heatsink not grounded for > various reasons. > > Jean-Paul > AC9GH > > On Jun 6, 2014, at 3:55 PM, Lorenzo Marcantonio <[email protected]> > wrote: > >> On Fri, Jun 06, 2014 at 03:50:11PM -0400, Jean-Paul Louis wrote: >>> How do you route 3 layer boards? Top layer (components), 2 inner layers and >>> no bottom layer is one configuration that come to mind? Those are not >>> common, but they exist out there. >> >> I suppose in the same way... just ignore one of the layers. BTW what >> would the benefit for not having the bottom layer? Just curious >> >> -- >> Lorenzo Marcantonio >> Logos Srl >> >> _______________________________________________ >> Mailing list: https://launchpad.net/~kicad-developers >> Post to : [email protected] >> Unsubscribe : https://launchpad.net/~kicad-developers >> More help : https://help.launchpad.net/ListHelp > _______________________________________________ Mailing list: https://launchpad.net/~kicad-developers Post to : [email protected] Unsubscribe : https://launchpad.net/~kicad-developers More help : https://help.launchpad.net/ListHelp
