begin quoting Andrew Lentvorski as of Tue, Jun 20, 2006 at 10:12:02PM -0700: > Stewart Stremler wrote: > > >That may be insufficient for modern CPUs. But wouldn't it be neat if > >they'd build in peltier cooling in the _chip_? > > Uh, why would I want to fold something which generates heat into my chip > that already produces too much heat?
Because you'd get finer control over what parts of the chip are getting cooled, and when? > Peltier devices don't just magically make things cool. They have to > ship that heat somewhere. And, BTW, Peltier devices also *generate* > quite a bit of heat by themselves. For every amount of heat they move, > they generate about 4x more heat of that same amount. Well, they aren't very efficient... :) > *ALL* of that heat has to be dissipated somehow. Yes. But if it's getting dumped into a heatsink eight inches (or eight feet) from the actual chip, it's somebody else's problem. The real problem, as I see it, is that there's a max temperature difference limiting things. What I *really* want is a thermal superconductor... but that comes of rereading Niven recently, I think. -- _ |\_ \| -- [email protected] http://www.kernel-panic.org/cgi-bin/mailman/listinfo/kplug-list
