Hi All,

No, I'm not aware of any IPR that applies to these four drafts.

Thanks,
Kenichi

--
Kenichi Ogaki
KDDI Corp. | NW Dev. Div.

-----Original Message-----
From: Joe Clarke (jclarke) <jcla...@cisco.com> 
Sent: Tuesday, September 26, 2023 12:29 AM
To: opsawg@ietf.org; mohamed.boucadair <mohamed.boucad...@orange.com>; Richard 
Roberts <rrobe...@juniper.net>; Oscar González de Dios 
<oscar.gonzalezded...@telefonica.com>; samir.barg...@gmail.com; Wubo (lana) 
<lana.w...@huawei.com>; victor.lo...@nokia.com; ivan.by...@rbbn.com; Qin Wu 
<bill...@huawei.com>; 大垣 健一 <ke-oog...@kddi.com>; luis-angel.mu...@vodafone.com
Subject: IPR POLL: Attachment circuits work

This is a consolidated poll for the following drafts:

*       draft-boro-opsawg-teas-common-ac
*       draft-boro-opsawg-teas-attachment-circuit
*       draft-boro-opsawg-ntw-attachment-circuit
*       draft-boro-opsawg-ac-lxsm-lxnm-glue

 

Authors and contributors on the To: line, please respond on-list as to whether 
or not you are aware of any IPR that pertains to this work.

Please state either:

 

"No, I'm not aware of any IPR that applies to this draft"

or

"Yes, I'm aware of IPR that applies to this draft"

 

If you are aware of IPR, indicate whether or not this has been disclosed per 
IETF IPR rules (see RFCs 3669, 5378, and 8179).

 

Joe

 

_______________________________________________
OPSAWG mailing list
OPSAWG@ietf.org
https://www.ietf.org/mailman/listinfo/opsawg

Reply via email to