Are you talking about a Step and Repeat Machine? *

That takes a photograph of the IC artwork, and reduces it in size, then 
prints 4 copies of the artwork 1/2 size. Then it does it again and you 
get 16 copies 1/4 size, again and you have 64 copies 1/8 size, etc. When 
you get the IC's down to the desired size you use the image to photo 
etch the IC's onto the wafer. I can see how there may be a minimum size 
limit, but not how there can be a maximum size limit. After all the 
original image is many times larger than the wafer. Of course there may 
well be a size limit on the automatic cutters that cut the wafers into 
individual IC's.

*My knowledge of this is ancient, they undoubtedly use digital imaging 
now, but the principle should be the same. I could do some research on 
modern IC production methods. But why? No one is going to hire me to 
design IC's for them <grin>.

-- 
graywolf
http://www.graywolfphoto.com
http://webpages.charter.net/graywolf
"Idiot Proof" <==> "Expert Proof"
-----------------------------------


Takeshita K wrote:
>  > On 28/08/06, Takeshita K <marinerone at gmail.com> wrote:
> 
>  >> My understanding is that the current size is the one which produces
>  >> the most yield under the current process using the stepper.
>  >> It's not the choice by the camera makers or sensor makers etc.
>  >> I used to have a link which explains this, but lost it.  Will dig it
> 
>  > I'm not familiar with the term "stepper:" in this context. Yield
>  > factors make a big difference to sensor manufacture affordability  
> over
>  > other general semiconductors which don't often exceed 10x10mm. The
>  > shear expanse of a sensor area means that due to the lower numbers of
>  > chips per silicon wafer (for all intents a fixed cost) any wafer
>  > contaminants will render a larger portion of the wafer to waste. And
>  > since wafers are circular (Sony now produced 300mm diameter wafers)
>  > the larger the sensor produced the more the waste.
> 
>  > The tech used to produce the sensor used in the Kodak 14MP FF meant
>  > that there were only 11 full sensors per wafer (approx 125mm  
> diameter)
>  > assuming a 100% yield, no wonder they were expensive. Think how many
>  > 24x16mm sensor could be shoehorned into a 300mm diameter wafer vs
>  > 36x24mm sensors, it's not a linear correlation.
> 
> My mail on this subject bounced, and that's probably because I  
> inadvertently used a different address.
> If it's duplicated somehow, my apology.
> Anyway....
> I have not dug into any specific site yet, but my memory goes like this.
> 
> This is indeed a "stepper' issue, and not about the usual yield per  
> wafer argument.
> APS-H size sensor is the maximum size that can be obtained by a one  
> shot exposure in the lithography process using a stepper. i.e., it's  
> a stepper-driven size limitation.  Anything smaller than that indeed  
> becomes a yield issue, i.e., max obtainable numbers per circular wafer.
> 
> Incidentally, Nikon is the world largest maker of the high  
> performance stepper which Sony also uses.
> 
> I thought I saw an article somewhere that Canon developed a process  
> (or probably stepper) which can make a FF size sensor in one shot  
> exposure, thus significantly reducing the cost of such sensor, hence 5D.
> 
> Nevertheless, my understanding is that the cost of the FF size  
> sensors is at least 10 times (or more)  that of the APS sized one,  
> and this gap is not going to narrow any time soon.
> 
> I also saw some articles that both Nikon and Pentax, particularly  
> Nikon, said that if the cost of FF sensors come down sufficiently to  
> make any commercial sense, and if the lens/sensor performance could  
> be reasonably conformed to such a sensor, there is no reason not to  
> produce FF machines.
> 
> But most of experts are predicting that APS size sensor has already  
> become a de facto standard, and with the performance of APS sized  
> sensor being rapidly increasing, they do not see any pressing need to  
> rush the FF machines.
> 
> We'll see.
> 
> Cheers,
> 
> Ken
> 

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