Xiangchen, just a fingerpoint:
> >1)I want to put via under the BGA pad. But I do not know if >there is any problem when to install the BGA chip. A via in a pad (BGA or not)will "steal" the solder during a reflow-prozess. You may close the via in a seperate pluging- prozess but that will reduce the fabs in possibility and increase the costs. Regards, Waldemar
____________________________________________________________ You are subscribed to the PEDA discussion forum To Post messages: mailto:[EMAIL PROTECTED] Unsubscribe and Other Options: http://techservinc.com/mailman/listinfo/peda_techservinc.com Browse or Search Old Archives (2001-2004): http://www.mail-archive.com/[EMAIL PROTECTED] Browse or Search Current Archives (2004-Current): http://www.mail-archive.com/[EMAIL PROTECTED]
