Jason
Thanks. For my 4-layered board, the BGA pads must be faned out to bottom layer by vias uder them. Can the microvia drill through the 2 planes and bottom layer?
Xiangchen
----- Original Message ----- From: "Jason Morgan" <[EMAIL PROTECTED]>
To: "Protel EDA Discussion List" <[EMAIL PROTECTED]>
Sent: Friday, October 29, 2004 5:16 PM
Subject: RE: [PEDA] put via under the BGA pad
Or you can use a microvia, which is a tiny via laser drilled through just one layer, its so small that it won't steal any solder. Again, its costly compared to 'normal' process.
j.
-----Original Message----- From: [EMAIL PROTECTED] [mailto:[EMAIL PROTECTED] Behalf Of Kulajew Waldemar Sent: 29 October 2004 07:56 To: Protel EDA Discussion List Subject: RE: [PEDA] put via under the BGA pad
Xiangchen,
just a fingerpoint:
1)I want to put via under the BGA pad. But I do not know if there is any problem when to install the BGA chip.
A via in a pad (BGA or not)will "steal" the solder during a reflow-prozess. You may close the via in a seperate pluging- prozess but that will reduce the fabs in possibility and increase the costs.
Regards,
Waldemar
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