I'm using Protel 99SE and I'm preparing for an upcoming layout that promises to be a bit tight. It includes BGA's with 0.8 - 1.0mm pitches. I'd appreciate comments/suggestions relating to manufacturability and design.
Here's what I'm planning:
Manual route. I haven't heard many positive comments regarding 99SE's auto router.
BGA and fine pitch parts will be fanned out with a via for each pad.
Minimum trace width/clearance = 0.005/0.005" (0.010" inner layers).
Minimum annular ring = 0.005" (That is 20/10 vias).
Minimum hole size = 0.010"
Layers = 6 or 8
LPI Solder Mask
.062" Board Thickness
1oz copper
HASL/SMOBC
FR4
Here are some questions: What situations force the use of blind &/or buried vias?
How do I design BGA land patterns? I don't have manufacturer recommended land patterns. I've been using the on-line IPC calculator for leaded parts, but it doesn't appear to have BGA capability.
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