Dennis,
Actually there was a little bit of both via in pad and dog bone
involved. Throw into the mix that we have a fabricator telling us that we must
stop tenting our vias because it is resulting in board contamination post
cleaning (the cleaning water contaminating the boards when it is not completely
removed from the blocked via holes) and you can see the problem coming at you
like a freight train.
The via size issue came to me from one of our engineers, I haven't seen
the articles myself, that would be the next step, see if I can actually see the
articles and quantify the precise case and conditions they are discussing.
Sincerely,
Brad Velander
Senior PCB Designer
Northern Airborne Technology
#14 - 1925 Kirschner Road,
Kelowna, BC, V1Y 4N7.
tel (250) 763-2329 ext. 225
fax (250) 762-3374
-----Original Message-----
From: Dennis Saputelli [mailto:[EMAIL PROTECTED]
Sent: Thursday, December 08, 2005 8:47 AM
To: Protel EDA Discussion List
Subject: Re: [PEDA] Via Solder Thieving, heard of this?
Hi Emanuel,
i think what you are writing about here is a different issue than we
were discussing
i believe the discussion was about having the via inside the BGA pad
itself, not the 'dogbone' via typically used to fan out the BGA pad
this is often called 'via in pad'
if the via inside the BGA pad is small enough the solder paste will not
flow through it
the topic is at what size this is good practice
i would call what you describe here more something like 'bridging' than
'theiving'
i would yell at your fabricator
these days there is no room for sloppy solder mask registration
Dennis Saputelli
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