Yes you have got it right, at least as far as my understanding goes.
And like I said, I haven't attended any recent seminars so possibly some things
are changing as the clock ticks closer and they nail down more precisely the
definitions of everything.
The last seminars I attended raised the figure of 0.5% of all lead
consumption goes into electronics. Therefore, if 100% of that completely
leached out of every electronic product in the world, it is still just a drop
in the bucket compared to the other sources.
Sincerely,
Brad Velander
Senior PCB Designer
Northern Airborne Technology
#14 - 1925 Kirschner Road,
Kelowna, BC, V1Y 4N7.
tel (250) 763-2329 ext. 225
fax (250) 762-3374
-----Original Message-----
From: Jon Elson [mailto:[EMAIL PROTECTED]
Sent: Thursday, December 08, 2005 2:55 PM
To: Protel EDA Discussion List
Subject: Re: [PEDA] Via Solder Thieving, heard of this?
Brad Velander wrote:
>Jon,
> I believe that the key to the 0.1% limitation is the fact that it must
> be a homogeneous part. i.e. one part that cannot be reduced to lesser
> sub-materials. A solderball on a BGA is not a homogeneous part. Basically I
> believe that no electrical component is a homogeneous part. I believe that a
> straight steel screw containing 0.1% lead content is a homogeneous part, a
> screw plated with something that contains 0.1% lead is not a homogeneous part
> because the plating can be removed and therefore is not homogeneous. Same
> would stand for a BGA. Unless there is something which has come along
> recently to change this since I last was looking at the issue(s).
> At least this is what I have come to understand about the 0.1%
> limitation. Otherwise there would be a lot of assemblies that could pass the
> 0.1% lead rule with no special lead-free concerns because the lead would not
> make up 0.1% of the total weight. The key word of concern is the word
> "homogeneous".
>
>
OK, so I think you are agreeing with me that the BGA parts with
Pb-containing
solder balls would not be RoHS compliant. Do I have that right?
The way you describe it, then, the entire BGA component must have absolutely
ZERO lead in it to be compliant. Only if the part is entirely homogeneous
can there be any lead at all in it.
I'm still totally astounded that we are fretting over milligrams of lead in
electronic devices while car batteries have tens of KILOGRAMS of lead in
them. My guess is that the amount of lead scattered about in car accidents
is WAY more than the lead leaching out of some circuit boards.
Jon
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