Emanuel,
You would like this thread to end and that's
reasonable but why do you continue asking questions?
I'm not THE expert but would have big question
marks about reliability of
mixing leaded BGA balls with lead free solder paste
resulting in a
completely unknown alloy and intermetallic effects.
Besides that they are
definitely not exempt from RoHS! Do you have any
further papers about
this?
Did I say that I was an expert? I only mentioned that
there were issues reported for BGAs and (could be a
specific part problems) it was mentioned that due to
these problems this BGA (or perhaps in general) would
continue to use the old lead soldering method although
the board was lead-free.
They didn't mention that lead-free solder paste would
be used. IMO they were talking about lead-free board,
leaded solder and leaded part as an exempt.
If I find the article, I'll send it to those who were
personally interested (not to the forum).
Mira
--- Emanuel Zimmermann <[EMAIL PROTECTED]> wrote:
Mira,
I'm not sure about Brad's luck! As Bob also stated
lead free will be the
norm in the near future and his avionics guys will
ask for leaded products
due to reliability issues.
But back to your first statement about leaded BGA in
lead free processes:
"
Due to these problems BGAs are the only parts that
will remain leaded even on a PB-free board.
"
I'm not THE expert but would have big question
marks about reliability of
mixing leaded BGA balls with lead free solder paste
resulting in a
completely unknown alloy and intermetallic effects.
Besides that they are
definitely not exempt from RoHS! Do you have any
further papers about
this?
BTW this discussion is quite off topic but for all
interested or in need
of lead free theres a LF list to subscribe at IPC:
http://listserv.ipc.org/scripts/wa.exe
regards,
Emanuel
---
MPL AG www.mpl.ch
Emanuel Zimmermann [EMAIL PROTECTED]
Manager R&D Phone: +41 56
483'34'34
Taefernstrasse 20 Fax: +41 56
493'30'20
CH-5405 Daettwil
---
[EMAIL PROTECTED] wrote on 09.12.2005
05:00:02:
Brad, you are lucky.
I don't have time to look for more documents right
now
but you may check these links:
http://www.ageussolutions.com/
http://de.farnell.com/images/en_UK/bespoke/rohs.pdf
Batteries are exempted:
http://www.dti.gov.uk/sustainability/weee/RoHS_Regs_Draft_Guidance.pdf
I think I read somewhere about the BGAs in regards
to
the soldering problems but I'm not sure if all are
exempted. I'll post it if I find it.
Mira
--- Brad Velander <[EMAIL PROTECTED]> wrote:
Count me lucky or what, LF is not a concern to
us?
Reportedly (I have not seen anything in writing
that grants that exemption but others swear to
it)
we are exempt as avionic equipment.
Sincerely,
Brad Velander
Senior PCB Designer
Northern Airborne Technology
#14 - 1925 Kirschner Road,
Kelowna, BC, V1Y 4N7.
tel (250) 763-2329 ext. 225
fax (250) 762-3374
-----Original Message-----
From: Mira [mailto:[EMAIL PROTECTED]
Sent: Thursday, December 08, 2005 10:10 AM
To: Protel EDA Discussion List
Subject: Re: [PEDA] Via Solder Thieving, heard
of
this?
Due to these problems BGAs are the only parts
that
will remain leaded even on a PB-free board.
Mira
--- Dennis Saputelli
<[EMAIL PROTECTED]> wrote:
that is a good point
in fact i have been wondering about how to
clean
under these things, it
has been my understanding that for BGAs the
preferred process is
no-clean because water is 'too big' and
solvent is
a
no-no
again, how does all this relate to lead-free ?
i think LF needs a more aggressive flux,
correct ?
ds
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