Gary,
Thanks for the solicitation. The one detail that I find missing quite
often from data sheets with regards to land pattern generation is the length of
the lead foot for standard SOIC type leads. They will usually have dimensions
to the toe but a number don't have a dimension to the heal, so one doesn't know
precisely what the length of the foot is. Some give that dimension to somewhere
along the bend(s) but not necessarily right to the heal which is what is needed
or desired.
This same information would also be needed for other packages besides
SOIC types, i.e. QFPs etc.. We need the actual foot length, heel to toe.
Oh, BGAs are the other pet peeve. Give use your pad size/diameter, as I
design BGA patterns the ideal methodology as I have been taught is that my pad
diameter should match the opposing devices pad diameter to equally match
characteristics/stresses on both sides of the ball. I don't care what the ball
diameter is and what sag/flat has occurred to your side of the ball, tell me
what pad size you used.
IC manufacturers usually aren't bad but could also follow suit on this
one. The ones that get to me are usually relays, switches or other module type
devices. Tell us specifically if they are showing a bottom or top view of the
device in their package drawings. Too many don't state and leave you guessing
or connecting up a part just to make sure.
Other than that you have a good start yourself with the pin lists.
Sincerely,
Brad Velander
Senior PCB Designer
Northern Airborne Technology
#14 - 1925 Kirschner Road,
Kelowna, BC, V1Y 4N7.
tel (250) 763-2329 ext. 225
fax (250) 762-3374
-----Original Message-----
From: [EMAIL PROTECTED] [mailto:[EMAIL PROTECTED]
Sent: Monday, January 23, 2006 10:31 AM
To: [email protected]
Subject: [PEDA] Component Data Sheets - your wish list
Hi all,
I happen to work at a component manufacturer, and at the moment I have
the opportunity to influence the next generation of component data
sheets for Micron Technology. I have often sat and fumed at data sheets
that were laid out poorly from the component librarian POV, so I'd like
to get as much input as possible on what would be an 'ideal' data sheet.
Snip
Gary Crowell, CID+
Micron Technology
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