There is a setting somewhere in the print/plot/gerber setup to print the keepout objects. This is set to "no" by default.
----- Original Message ----- From: "Wayne Trow" <[EMAIL PROTECTED]> To: "Protel EDA Forum" <[EMAIL PROTECTED]> Sent: Thursday, November 22, 2001 8:12 AM Subject: Re: [PEDA] How to use objects as keepouts? > > Charlie > > When you place a keepout fill I dont think it gets plotted in the gerber > files so you wont end up with a unconnected piece of copper under your SMD. > > I could be wrong - its happened before :-) > > Wayne > > > > > "Jenkins, > Charlie" To: "'Protel Users Mailing List'" <[EMAIL PROTECTED]> > <JENKINSC@PIOS cc: > .COM> Subject: [PEDA] How to use objects as keepouts? > > 22/11/01 07:35 > Please respond > to "Protel EDA > Forum" > > > > > > > I noticed at some point that a keepout check box was added to the fill > properties. I have long wanted to place a top or bottom only keepout in > between certain surface mount pads such that copper pours were prevented > from filling in between pads that had a layer specific keepout. > > Unfortunately to make the keepout layer-specific the fill that will be > turned into a keepout must be on a single side layer, like Toplayer or > Topoverlay. Unfortunately the fill must be associated with a conductive > layer to prevent polygons on that layer from over-running the > fill-made-keepout. This now leaves a chunk of copper in between the pads > in > place of the pour. Better but not what is needed. > > I thought of using very thin traces in the form of a rectangle with no net > to block the migration of the pour. Of course there would have to be a set > of rules written to keep the DRC happy. > > Ideally we could make an all-sides keepout fill be layer specific by > selecting the desired layer in a "Constrain Keepout to a Specific Layer" > pull down but that does not exist yet. > > Does anyone have any better ideas how to keep pours on a given layer from > passing through certain pads. The solution should be able to be saved with > the footprint and should not involve using larger clearance rules. > > The reason for this requirement is to keep the copper from between surface > mount pads when using circuit board routers to prototype SMT boards. Since > solder masking is typically not used with this type of prototype, copper > under components like caps and resistors can lead to shorts from paste > reflow. The selective keepout would prevent the polygon from getting under > some of these small components. > > Charlie Jenkins, Pioneer > > > * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/[email protected] * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
