Even if it has been talked about I would add that this is very much needed
in capability. However or if ever Altium decides to implement something like
this.
But as the software stands now it is very clunky with respect
to package info on a mechanical layer with respect to two sided assemblies.
Too much effort from what I see to deal with this appropriately other
than making a top and bottom footprints, which really takes us backwards
a few years in the way of doing things.
Bob
Robert M. Wolfe, C.I.D.
[EMAIL PROTECTED]
----- Original Message -----
From: "Jason Morgan" <[EMAIL PROTECTED]>
To: "'Protel EDA Forum'" <[EMAIL PROTECTED]>
Sent: Friday, February 22, 2002 12:37 PM
Subject: Re: [PEDA] Inversion - WAS: PCB view from bottom of board??


> On this subject, (I appologise if this has already been mentioned as I've
> not followed the thread too well)
>
> Another thing to add to the protel wish list should be mechanical layer
> pairs.
>
> It should be possible for each mechanical (M) layer to pair it with
another.
>
> Such that that when a component that has entities on a mech layer. (e.g.
> assembly on layer M2) When inverted to place the component on the other
side
> of the board will also place those entities on a different M layer and
> mirror them appropriatly.
>
> Here we try and diferentiate between silkscreen and assembly drawing as
> board densites do not allow one to be used as the other.
>
>
> Incedently I do the above using a home brew server, but its a bit clunky.
>
> Jason.
>


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