We have done some designs using this type of part and the package type
originates from Anam Amkor. You could try there website - www.amkor.com. The
boards designed here used clamped devices ( not soldered) but I added a fairly
large holed via in the middle of the exposed pad area for hand soldering if
required.
Clive
"Steve Baldwin" <[EMAIL PROTECTED]> on 03/06/2002 07:25:59 AM
Please respond to "Protel EDA Forum" <[EMAIL PROTECTED]>
To: "Protel EDA Forum" <[EMAIL PROTECTED]>
cc: (bcc: Clive Broome/sdc)
Subject: [PEDA] TSSOP Power Pad
Does anyone have pointers to footprint guidelines for Power Pad
parts, particularly TSSOP (28 pin in this case).
If I put a pad down the same size as the powerpad and screen
solder onto it, I would expect the part to sit up on the meniscus
when the solder melts and I'd get poor/missed joints at the pins.
I would have expected to have a pad the same size as the power
pad but to only screen a tiny bit of solder on to it.
This is all conjecture and I didn't find anything useful with Google or
my usual PCB links.
Anyone know more about these things ?
Steve.
======================================================
Steve Baldwin Electronic Product Design
TLA Microsystems Ltd Microcontroller Specialists
PO Box 15-680, New Lynn http://www.tla.co.nz
Auckland, New Zealand ph +64 9 820-2221
email: [EMAIL PROTECTED] fax +64 9 820-1929
======================================================
* * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
* To post a message: mailto:[EMAIL PROTECTED]
*
* To leave this list visit:
* http://www.techservinc.com/protelusers/leave.html
*
* Contact the list manager:
* mailto:[EMAIL PROTECTED]
*
* Forum Guidelines Rules:
* http://www.techservinc.com/protelusers/forumrules.html
*
* Browse or Search previous postings:
* http://www.mail-archive.com/proteledaforum@techservinc.com
* * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
