> I checked the source we use for our footprints and on the TSSOP 28 > pin devices with the bottom tab, they suggest a pad the same size as > the tab and their common solder paste deposition of 0.006 - 0.008
Ah ! The penny drops. That corresponds to the distance between the base of the package and the board so as soon as it wets, it'll pull the package down just right. Thanks, Steve. ====================================================== Steve Baldwin Electronic Product Design TLA Microsystems Ltd Microcontroller Specialists PO Box 15-680, New Lynn http://www.tla.co.nz Auckland, New Zealand ph +64 9 820-2221 email: [EMAIL PROTECTED] fax +64 9 820-1929 ====================================================== * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/[email protected] * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
