Hi Adeel,
If you've got a very densed board, you may consider reflow soldering on both sides. The footprints for reflow are smaller and you can gain much free space for the tracks. The disadvantage is that it's more expensive but you are free to place your components as you wish. The limitations may come from the assembly of the components (or company) and you mechanics. If you have mixed design (TH and SMD), you'll have to use wave soldering for high volume production. In this case you'll have to pay attention on all components placed on bottom side. The orientation is important and the footprints are quite larger. You have to choose the wave direction before you start placing your components. If you use an assembly house, you'd better ask them for some guidelines. If not, you may find information in internet of what your footprints should be. Take a look at Phillips site. Mira --- Adeel Malik <[EMAIL PROTECTED]> wrote: > Hi Danny, > > Thanks for the reply. Can you plz comment on the > process details carrried > out both in Wave Soldering and Reflow Soldering ?. > Secondly, is there any > alignment requirement for the SMD components being > soldered by wave or > reflow technique (e.g some fab houses recommend that > rectangular SMD chips > like SO-16 packages be placed parallel to the > horizontal axis of the board > so that pins on both sides receive equal intensity > wave). > Regards, > Adeel > > -----Original Message----- > From: Danny Bishop > [mailto:[EMAIL PROTECTED]] > Sent: Friday, May 31, 2002 11:06 AM > To: 'Protel EDA Forum' > Subject: Re: [PEDA] Soldering Techniques > > > HI Adeel > > Wave soldering is only choice for soldering through > hole parts in bulk. You > can potentially save money by putting SMD parts on > the opposite side to the > thru hole parts and solder them all in one go. Wave > soldering is not as > reliable as reflow however, and requires adherence > to fairly restrictive > placement rules, which limit the density. > > Reflow is more reliable, and allows a denser layout > of SMD components, but > is an extra process if you are already wave > soldering the through hole > parts. > > regards > > Danny > > > -----Original Message----- > > From: Adeel Malik [mailto:[EMAIL PROTECTED]] > > Sent: Friday, 31 May 2002 4:07 PM > > To: Protel EDA Forum > > Subject: [PEDA] Soldering Techniques > > > > > > Most Board-Population vendors use two techniques > for > > soldering namely Wave > > Soldering and Reflow Soldering. Can someone tell > me about the > > pros and cons > > of each type (which type is better for > High-density and High > > Performance > > boards) ?. > > > > Regards > > ADEEL MALIK, > > > > * * * * * * * * * * * * * * * * * * * * * * * * * * > * * * * > * To post a message: > mailto:[EMAIL PROTECTED] > * > * To leave this list visit: > * http://www.techservinc.com/protelusers/leave.html > * > * Contact the list manager: > * mailto:[EMAIL PROTECTED] > * > * Forum Guidelines Rules: > * > http://www.techservinc.com/protelusers/forumrules.html > * > * Browse or Search previous postings: > * > http://www.mail-archive.com/proteledaforum@techservinc.com > * * * * * * * * * * * * * * * * * * * * * * * * * * > * * * * __________________________________________________ Do You Yahoo!? Yahoo! - Official partner of 2002 FIFA World Cup http://fifaworldcup.yahoo.com * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/proteledaforum@techservinc.com * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
