Michael Biggs wrote:

> Hi all,
>         Anyone run very hot traces @ like 90 degree C on there PWBs and or
> use surface mount heat sink around the component( like a D-PAK)?
> Thanks for any response.
> I know this is a Protel questions group but everyone seem knowledgeable in
> design layout.

I would assume that over a fairly short time the epoxy holding the copper to
the laminate would deteriorate, and the foil would lift off the board due to
the thermal mismatch.  Some cycles of this might cause the foil to crack.

I'm pretty sure a recognized safety testing lab would not approve any
device designed that way, if they discovered that is what you were doing.

Using a foil area to draw heat away from a heat source is pretty common
practice.  I imagine some people let their junctions run at 90 C, but I
suspect the heat sink surface runs cooler than that.

Jon


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