I have used polygon areas as heat sinks before. These were for resistors and TO-220 transistors.
I don't recall any temperature problems. I would think the semiconductor would die before the PCB materials would separate or the solder would melt. You should consider putting a grid of vias around the part to transfer heat to a second copper polygon on the opposite PCB side. This will increase your dissipation ability (2 sides are better than one, and it minimizes the thermal shear). Don't use too many vias, though because this will cut down on the total area of copper. I would say restrict via area to no more than 10% of the board area around the part. Best regards, Ivan Baggett Bagotronix Inc. website: www.bagotronix.com ----- Original Message ----- From: "Michael Biggs" <[EMAIL PROTECTED]> To: "'Protel EDA Forum'" <[EMAIL PROTECTED]> Sent: Wednesday, July 17, 2002 4:17 PM Subject: [PEDA] 90 degree C? > Hi all, > Anyone run very hot traces @ like 90 degree C on there PWBs and or > use surface mount heat sink around the component( like a D-PAK)? > Thanks for any response. > I know this is a Protel questions group but everyone seem knowledgeable in > design layout. > > Sincerely, > Michael Biggs > > > ************************************************************************ > * Tracking #: 5456DC91B0E6594D800901572599FFB1DD93CAE2 > * > ************************************************************************ > * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/[email protected] * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
