>>More likely, they're suffering from islands of resist detaching and floating around, causing 5 thou gaps wherever they land. I've certainly been asked to avoid similar features (although normally it's tracks leaving pads and looping round the side of the pad, <<
Good point. I once had trouble with solder mask over solder plated tracks with large copper areas. When it went through wave solder the solder mask would delaminate on the melted solder and end up "scooping" up globs of solder. I solved this with cross hatch copper areas instead of solid copper areas. This problem goes away with SMOBC, which is my preference. But as track density went up and feature size went down, I started making my cross hatch pattern very fine, not realizing I could be causing a fab problem. I guess I will just go back to solid copper, not much reason for the cross hatch any more. Thanks for all the quick yet thoughtful responses. Lloyd ************************************************************************ * Tracking #: 8BE5C309EF15E547B247461A556B0D081A4951B8 * ************************************************************************ * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/[email protected] * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
