Hi,
I'd like to use a large, unmasked, plated, copper pour, on a single layer, to 
perform as a heat sink for a D-Pak regulator.  

I need to quantify the thermal resistance of the copper pour to ambient.  I 
know it's based on copper thickness and copper area.  I'm uncertain how to boil 
down to thermal resistance.

Any help or applicable links is appreciated.

Regards,
Steve 


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