Can get I a few opinions about how you guys handle BGA components in your
layouts?
Do you generally tent (using tenting in Protel99SE via properties) the
dog-bone vias that branch off of each BGA pad to prevent solder thieving or
specify in your specifications to Plug top side vias. There may be other
ideas and I'm sure the responses will vary on the assembly methods.
Generally I see a reflow then wave on these mixed technology PWA I am
prototyping.
Thanks in advance.
-MB


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