RE: EN55022:1995 vs EN55022:1998

2000-05-24 Thread Joshua Wiseman
Cyril,

In reading the new standard one thing that caught my eyes is that
Telecommunication ports are re-defined. In this case a Telecommunications is
anything that hooks to a network i.e. LAN/WAN environments.

For that reason alone I have to test to the new portion of the standard, but
I am not required to do so in the immunity portion of testing.

My two cents...

Josh

-Original Message-
From: Binnom, Cyril A [mailto:binno...@ems-t.com]
Sent: Wednesday, May 24, 2000 11:49 AM
To: emc-pstc
Subject: EN55022:1995 vs EN55022:1998




Group,

I have some questions regarding EN 55022:1998.

1) Judging by what I have read it would seem that if  your products are
without telecommunication ports then you are already compliant to EN
55022:1998 since all changes to the new standard are telecommunication
product based. 

2) If question one is accurate then can the previous EN 55022:1995 data be
used to update the Declaration of Conformity to the 1998 standard or does
new data need to be taken?

Thank you in advance for your help

Cyril A. Binnom Jr.
EMI/EMC Approvals Engineer
(770) 447-4224 Ext.3240
(770) 447-6928 Fax
e-mail binno...@lxe.com

Visit Our Website at:
http://www.lxe.com



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Quiet Expert

2000-05-24 Thread Dale Albright

Group,

I am in the process of evaluating an EMI analysis tool.  The program is
Quiet Expert by Innoveda (formally Viewlogic as I understand it).  Is
anyone using this program or have you evaluated it along with others?

Dale




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Re:RE: Charge moving from decoupling capacitors

2000-05-24 Thread Jim Bacher

Forwarded for George..

Reply Separator
Subject:RE: Charge moving from decoupling capacitors
Author: george_t...@dell.com
List-Post: emc-pstc@listserv.ieee.org
Date:   5/23/00 12:35 PM

Let's say that you have a cap placed at 1/4 wavelength away from an IC pwr
pin.  When the IC draws current from the Pwr/gnd planes, it causes a voltage
dip/pwr bounce on the parallel planes.  This voltage dip propagates to the
cap at 1/4 wavelength away and draws current out of the cap.  The current
from the cap propagates back to the IC pwr pin at 1/4 wavelength away.  The
total travel for the incident and reflected wave is 1/4 + 1/4 = 1/2
wavelength.  The supply current is 180 degrees out of phase from the IC
switching current.  Some people say that the cap needs to be closer than 1/2
of rising edge.  But you can also calculate the wavelength of the 3rd and
5th harmonic of your pulse to determine your cap placement.  

Regards, 

George Tang
george_t...@dell.com



-Original Message-
From: Roncone Paolo [mailto:paolo.ronc...@compuprint.it]
Sent: Tuesday, May 23, 2000 7:15 AM
To: 'george_t...@dell.com '; 'barry...@altavista.com '
Cc: 'emc-p...@ieee.org '
Subject: RE: Charge moving from decoupling capacitors



George,
can you pls explain your correction ?
I supposed your first statement (At 1/4 wavelength, the charges are 90 
degrees out of phase) was the correct one ! 

Paolo Roncone
Compuprint s.p.a.

Reply Separator
Subject:RE: Charge moving from decoupling capacitors
Author: george_t...@dell.com
List-Post: emc-pstc@listserv.ieee.org
Date:   5/22/00 9:14 PM

Barry, 

I need to make a correction.  I was rushing to lunch on Thursday, so I
did
not read over what I wrote.  Here is the correction for the 2nd comment
below: 

At 1/4 wavelength, the charges are 180 degrees out of phase, so they are
working against the IC current draw.  1/8 wavelength (90 degrees out of
phase) is what I consider to be acceptable.  

Regards, 

George Tang
george_t...@dell.com



-Original Message-
From: Tang, George 
Sent: Thursday, May 18, 2000 12:31 PM
To: 'Barry Ma'; Tang, George
Cc: si-l...@silab.eng.sun.com; emc-p...@ieee.org
Subject: RE: Charge moving from decoupling capacitors


Barry, 

Thanks for the comments.  Here are my comments:  

Ok, you put caps at a certain distance away from the IC because you only
want them to work at 100 MHz.  But that distance turns out to be the 1/4
wave distance at 400 MHz, and you placed enough caps at the 1/4 wave
distance to cause board resonance.  Now what?  Do you tell the caps not
to
work at 400 MHz because it's not their frequency?  


For your 2nd comment:

I used the words loosely define for that reason.  If you are
interested in
high frequency decoupling and instantaneous current, you really want to
have
all your charges moving in phase.  At 1/4 wavelength, the charges are 90
degrees out of phase, so they will not do much for your instantaneous
current.  1/8 wavelength is what I consider to be acceptable.  You can
certainly pick a different number.  

Regards, 

George Tang
george_t...@dell.com



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CISPR 24 and telecom ports

2000-05-24 Thread Guy Story

I am looking to see what the general conception is on I/O port conducted
emissions and surge immunity is.  The company I work for manufactures
various types of network cards.  Some of these tie to the outside word
(public network) and others are LAN based.  I can see performing the testing
on ISDN and other style devices but not to a device, say and Ethernet card
or a device, that does not access the public network directly.  I have not
read over the CISPR 24 document yet but based on what I have been told, the
spec is vague on the areas of I/O ports and the outside world.

Regards,

Guy Story, KC5GOI
Compliance Technician
Interphase Corporation
Dallas Texas
phone: 214.654.5161
fax: 214.654.5406


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EN55022:1995 vs EN55022:1998

2000-05-24 Thread Binnom, Cyril A


Group,

I have some questions regarding EN 55022:1998.

1) Judging by what I have read it would seem that if  your products are
without telecommunication ports then you are already compliant to EN
55022:1998 since all changes to the new standard are telecommunication
product based. 

2) If question one is accurate then can the previous EN 55022:1995 data be
used to update the Declaration of Conformity to the 1998 standard or does
new data need to be taken?

Thank you in advance for your help

Cyril A. Binnom Jr.
EMI/EMC Approvals Engineer
(770) 447-4224 Ext.3240
(770) 447-6928 Fax
e-mail binno...@lxe.com

Visit Our Website at:
http://www.lxe.com



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Fwd: Split Plane

2000-05-24 Thread Barry Ma

Subject: RE: [SI-LIST] : Split Plane
To: si-l...@silab.eng.sun.com
From: Barry Ma barry...@altavista.com
List-Post: emc-pstc@listserv.ieee.org
Date: 24 May 2000 10:51:29 PDT

Another reason, I guess, is that you are not confident to use pwr planes as 
signal return planes. You said: We pulled out all the stops to ensure every 
signal layer is referenced to a ground plane, rather than a power plane, which 
I understand should give better EMC performance. 

I'd like to say it again, it's OK to use pwr planes if you have enough 
interplane capacitance.

Regards,
Barry Ma
b...@anritsu.com

On Wed, 24 May 2000, Brad Crowell wrote:

 Christoph
 
 I agree with your suggestion and we did consider this but the additional
 cost was the overriding factor.
 
 Brad
 
  -Original Message-
  From: owner-si-l...@silab.eng.sun.com
  Sent: Wednesday, May 24, 2000 10:29 AM
  To: si-l...@silab.eng.sun.com
  Subject: RE: [SI-LIST] : Split Plane
  
  Brad,
 
  Did you think about doing this job using MicroVia technology? In this case 
you would be able to cover the top and bottom layer with ground, as the 
Fanout-Vias are in the pad.
  So the top and bottom ground plane will be real planes over the whole board! 
Then the stackup could look like this:
 
  GND
  Signal
  Signal
  3.3V
  GND
  Signal
  Signal
  GND
  5V
  Signal
  Signal
  GND
 
  Because of the MicroVias, you will be able to route much more effective, as 
they
  don't block other layers - perhaps you can even save one or two signal layers.
  If you are looking for good EMI performance, this would be a good idea.
 
  Christoph Hillen
  Utimaco Safeware AG
  Germany




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RE: ISM prohibited frequencies

2000-05-24 Thread Bandele Adepoju

Hello Jenkins,

As long as the levels in the restricted bands are below the
limits specified in 15.209, you should be okay. No frequency
(fundamental or harmonic or 'internal functioning') within a
restricted band can exceed the levels specified in 15.209.

Regards,

Bandele 
Jetstream Communications, Inc.
badep...@jetstream.com

 

-Original Message-
From: JENKINS, JEFF [mailto:jeff.jenk...@aei.com]
Sent: Wednesday, May 24, 2000 7:38 AM
To: emc-p...@majordomo.ieee.org
Subject: ISM prohibited frequencies



I have a question about ISM prohibited frequencies according to 47 CFR Part
18.  Section 18.303 says that operation in the prohibited frequency bands
is not allowed.  My question is, what is their interpretation of the word
operation?
 
1.) If the equipment in question uses these frequencies only for internal
functioning, is it still prohibited?  (In other words, the energy does not
intentionally leave the equipment enclosure.)
 
2.) If the equipment sweeps through a prohibited band while it auto-tunes,
is this a problem?
 
3.) What if the fundamental operating frequency of the equipment is outside
the prohibited bands, but there is significant harmonic energy within a
prohibited band?
 
Thanks,
 
Jeff Jenkins
Regulatory Compliance
Advanced Energy Industries, Inc.
Fort Collins, CO USA

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Re: ISM prohibited frequencies

2000-05-24 Thread WmFlan

I asked the same questions of the FCC a couple of years ago and was told (reply 
your Q):

(2)The sweep-through wasn't necessarily a problem if powered operation was not 
possible within the prohibited bands.

(3)Harmonics...(partly my interpretation)then you are responsible to assure 
that emissions are 10uV/m @ 1600m for these emissions

(1) internal (entirely my own...) The FCC are concerned with interference with 
emergency/rescue services; if your oscillators' signals are contained, there 
can be no interference.

HTH

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Fwd: [SI-LIST] : Announcement, new book

2000-05-24 Thread Barry Ma

--- Start of forwarded message ---
 
To: si-l...@silab.eng.sun.com
Subject: [SI-LIST] : Announcement, new book
From: Doug Brooks d...@eskimo.com
List-Post: emc-pstc@listserv.ieee.org
Date: Tue, 23 May 2000 16:18:43 -0700

UltraCAD has just published its new book
Electrical Engineering for the Non-Degreed Engineer

The book is specifically written for people in the PCB design, fabrication 
and assembly industry and covers the basics of EE up through impedance and 
RLC phase shifts.

Although most of you on this list don't need a book like this, I believe 
you all work with people who COULD use it. It has already been adopted for 
class use in one of the Community Colleges in Texas.

You can review the book and the table of contents on our web site,
http://www.ultracad.com

Thanks

Doug Brooks

.

Doug Brooks' book Electrical Engineering for the Non-Degreed
Engineer is now available. See our web site for details.
.
Doug Brooks, President  d...@eskimo.com
UltraCAD Design, Inc.   http://www.ultracad.com



--- End of forwarded message ---


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ISM prohibited frequencies

2000-05-24 Thread JENKINS, JEFF

I have a question about ISM prohibited frequencies according to 47 CFR Part
18.  Section 18.303 says that operation in the prohibited frequency bands
is not allowed.  My question is, what is their interpretation of the word
operation?
 
1.) If the equipment in question uses these frequencies only for internal
functioning, is it still prohibited?  (In other words, the energy does not
intentionally leave the equipment enclosure.)
 
2.) If the equipment sweeps through a prohibited band while it auto-tunes,
is this a problem?
 
3.) What if the fundamental operating frequency of the equipment is outside
the prohibited bands, but there is significant harmonic energy within a
prohibited band?
 
Thanks,
 
Jeff Jenkins
Regulatory Compliance
Advanced Energy Industries, Inc.
Fort Collins, CO USA

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RE: Evaluation Boards

2000-05-24 Thread David_Sterner

 
 John,
 For developmental boards the pertinent paragraphs of CFR47 immediately 
 follow the text you transcribed.  FCC clearly exempts boards used for 
 development at a customer facility under paragraphs (v) and (2),
however 
 the marking requirement applies.
 
 (iv) Evaluation of product performance and determination of customer 
 acceptability, provided such operation takes place at the
manufacturer's 
 facilities during developmental, design, or pre-production states; or
 (v) Evaluation of product performance and determination of customer 
 acceptability where customer acceptability of a radio frequency device 
 cannot be determined at the manufacturer's facilities because of size
or 
 unique capability of the device, provided the device is operated at a 
 business commercial, industrial, scientific, or medical user's site,
but 
 not at a residential site, during the development, design or
pre-production 
 stages.  A product operated under this provision shall be labeled, in a

 conspicuous location with the notice in paragraph (c) of this section.
 (2) For the purpose of paragraphs (e)(1)(v) of this section, the term 
 'manufacturer's facilities' includes the facilities of the party 
 responsible for compliance with the regulations and the manufacturer's 
 premises, as well as the facilities of other entities working under the

 authorization of the responsible party in connection with the
development 
 and manufacture, but not marketing, of the equipment.
 
 'Marketing' is subject to interpretation; many companies have technical

 marketing departments with their own development labs.  My
interpretation:  
 to demonstrate ~ in front of customers, the marketing paragraphs apply.
 
 David

__ Reply Separator
_
Subject: RE: Evaluation Boards
Author:  jestuckey SMTP:jestuc...@micron.com at ADEMCONET
List-Post: emc-pstc@listserv.ieee.org
Date:5/23/2000 10:56 AM


I had forwarded this to Vic upon receiving his request last week, but 
viewing some on the responses that I have seen, I feel it would be 
appropriate to put it out for general viewing.
 
Look at 47 CFR
 2.803 Marketing of radio frequency devices prior to equipment 
authorization.
(a) Except as provided elsewhere in this section, no person shall sell or 
lease, or offer for sale or lease (including advertising for sale or lease),

or import, ship, or distribute for the purpose of selling or leasing or 
offering for sale or lease, any radio frequency device unless:
(1) In the case of a device subject to certification, such device has been 
authorized by the Commission in accordance with the rules in this chapter 
and is properly identified and labeled as required by  2.925 and other 
relevant sections in this chapter; or
(2) In the case of a device that is not required to have a grant of 
equipment authorization issued by the Commission, but which must comply with

the specified technical standards prior to use, such device also complies 
with all applicable administrative (including verification of the equipment 
or authorization under a Declaration of Conformity, where required), 
technical, labeling and identification requirements specified in this 
chapter.
(b) The provisions of paragraph (a) of this section do not prohibit 
conditional sales contracts between manufacturers and wholesalers or 
retailers where de-livery is contingent upon compliance with the applicable 
equipment authorization and technical requirements, nor do they prohibit 
agreements between such parties to produce new products, manufactured in 
accordance with designated specifications.
(c) Notwithstanding the provisions of paragraphs (a), (b), (d) and (f) of 
this section, a radio frequency device may be advertised or displayed, e.g.,

at a trade show or exhibition, prior to equipment authorization or, for 
devices not subject to the equipment authorization requirements, prior to a 
determination of compliance with the applicable technical requirements 
provided that the advertising contains, and the display is accompanied by, a

conspicuous notice worded as follows:
 
This device has not been authorized as required by the rules of the Federal 
Communications Commission. This device is not, and may not be, offered for 
sale or lease, or sold or leased, until authorization is obtained.
 
(1) If the product being displayed is a prototype of a product that has been

properly authorized and the prototype, itself, is not authorized due to 
differences between the prototype and the authorized product, the following 
disclaimer notice may be used in lieu of the notice stated in paragraph (c) 
introductory text of this section:
 
Prototype. Not for sale.
 
(2) Except as provided elsewhere in this chapter, devices displayed under 
the provisions of paragraphs (c) introductory 

Re: interference to Comm devices due to overhead catenaries

2000-05-24 Thread Ralph Cameron

Susan:

Are the catenaries enrgized?  In any event you can expect some signal
degradation and perhaps complete cancellation as the locomotive moves
becuase the catenaries will screen the GPS signals.  As you may be aware,
GPS relies on a minimum of two visible satellite signals and sometimes is
able to see six or more which makes accuracy more achievable.

Any metallic medium interspersed between the GPS antenna and the direct
satellite signal will cause a certain attenuation to the signal.

Can you provide more specifics?

Ralph Cameron
EMC Consultant for Suppression of Consumer Electronics
(After Sale)

- Original Message -
From: Beard, Susan sbe...@ge-harris.com
To: emc-p...@ieee.org
Sent: Tuesday, May 23, 2000 3:56 PM
Subject: interference to Comm devices due to overhead catenaries



 Could anyone provide any information relative to overhead catenary noise
and
 its affects on locomotive roof top comm systems (e.g., GPS)?

 Susan Beard

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RE: Concerning DoC and RTTE

2000-05-24 Thread Allan, James

The way I read my fresh new copy of the New Blue Guide thanks to Art
Michael and others yesterday the paragraph immediately preceding the snip
included below by Kim tells the story. I am sorry that I can't include the
text verbatim but my copy is PDF format. The paragraph defines products that
must be accompanied by the EC DoC as gas appliances, potentially explosive
atmospheres, recreational craft, lifts, and high speed rail. This reflects
into the paragraph included by Kim where it is defined that these DoC's that
must accompany the product must be in the language of the country of use.
It is implied that other than the mentioned directives it is OK to use only
one of the languages of the Member States. I would interpret this to mean
one language is OK for RTTE DoC's and that the DoC need not accompany the
product with each shipment.  Are there any other opinions out there because
this is only one man's opinion? 

 Having heard on this board some comments that some Member States prefer
having DoC's with each shipment (ITE and RTTE), I am considering having a
copy of the DoC included with the product manual in English. Does anyone see
a problem in following this approach?  The intent is to include an exact
replica of the DoC with a statement in the signature area defining the
location of the original signed DoC.


Jim Allan
Senior Compliance Engineer
Milgo Solutions Inc.
E-mail james_al...@milgo.com

 -Original Message-
 From: k...@i-data.com [SMTP:k...@i-data.com]
 Sent: Wednesday, May 24, 2000 4:19 AM
 To:   emc-p...@majordomo.ieee.org; t...@world.std.com
 Subject:  Concerning DoC and RTTE
 
 
   Dear All:

 I'm still confused by the answers I have got concerning the languages of
 the DoC. I still understand what I'm reading as if I need to provide the
 DoC in all legal EU language if I want to sell my product in all EU
 countries.
 
 Here are my references:
 
 
 RTTE directive (L91/16) Article 6
 
 3. Member States shall ensure that the manufacturer or
 the person responsible for placing the apparatus on the
 market provides information for the user on the intended
 use of the apparatus, together with the declaration of
 conformity to the essential requirements.
 
 
 This is taken from page 60 of the New Blue Guide
 
 The EC declaration of conformity must be drawn up in one of the official
 languages of the
 Community. If the Community directives contain no further provisions
 concerning the
 language of the declaration, the requirements of the Member States to use
 a specific
 language must be assessed according to Art. 28 and 30 of the EC Treaty, on
 a case by case
 basis. However, for products, which are required to be accompanied by the
 declaration of
 conformity, it has to be in the official language of the country of use.
 In these situations a
 translation should be provided by the manufacturer, his authorised
 representative or the
 distributor. Additionally, a copy of the declaration in the original
 language should be
 supplied.
 
 Please help me ? I would like to use only 1 or 2 languages if possible.
 
 Best regards,
 
 Kim Boll Jensen
 i-data international
 Denmark
 
 
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 Richard Nute:   ri...@ieee.org



Concerning DoC and RTTE

2000-05-24 Thread KBJ

Dear all

I'm still confused by the answers I have got concerning the languages of
the DoC. I still understand what I'm reading as if I need to provide the
DoC in all legal EU language if I want to sell my product in all EU
countries.

Here are my references:


RTTE directive (L91/16) Article 6

3. Member States shall ensure that the manufacturer or
the person responsible for placing the apparatus on the
market provides information for the user on the intended
use of the apparatus, together with the declaration of
conformity to the essential requirements.


This is taken from page 60 of the New Blue Guide

The EC declaration of conformity must be drawn up in one of the official 
languages of the
Community. If the Community directives contain no further provisions concerning 
the
language of the declaration, the requirements of the Member States to use a 
specific
language must be assessed according to Art. 28 and 30 of the EC Treaty, on a 
case by case
basis. However, for products, which are required to be accompanied by the 
declaration of
conformity, it has to be in the official language of the country of use. In 
these situations a
translation should be provided by the manufacturer, his authorised 
representative or the
distributor. Additionally, a copy of the declaration in the original language 
should be
supplied.

Please help me ? I would like to use only 1 or 2 languages if possible.

Best regards,

Kim Boll Jensen
i-data international
Denmark


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Re: Breakdown voltage between pcb layers

2000-05-24 Thread JPR3

In a message dated 5/23/00, David Gelfand writes:

  We have an emissions problem on a board and I would like to suggest a 
ground
  plane in the area of an RJ-45 jack (TNV-1).  But we have always asked our 
PCB
  designers to leave TNV traces free of ground and power planes to avoid 
  arcing during surge and dialectric strength tests.
  
  Does anyone know where to find specs on breakdown voltages between PCB 
layers?
  Has anyone successfully used  ground planes above or below TNV traces?  We 
  are testing to UL1950 and Part 68.


David:

I do not think it is a good idea to put ground plane under your TNV-1 
circuits.  It is possible to do this, but I do not recommend it.  You do not 
mention the type of EMC problem you are trying to resolve, but if it is an 
emissions problem, the first choice would be to add a common mode choke in 
series with tip/ring.  

If that alone is not sufficient, you can sometimes add small value caps (100 
pF or so) from tip to chassis and from ring to chassis.  Since these 
capacitors bridge the isolation barrier, they must be suitable high voltage 
caps.  Capacitors in these locations can be very helpful if you have a 
quiet metal chassis to connect them to, but they are useless and even 
potentially harmful for EMC if the product has only a plastic housing with no 
real chassis.  When adding capacitors, you must also watch out for 
detrimental effects on the intended signal.

If you are still intent on adding a ground plane under your TNV-1 circuit, 
the main requirement for both FCC Part 68 and UL 1950 will be to pass a 1000 
VRMS hipot test.  You can do this by carefully specifying the required 
insulation between the relevant layers, but now your board stack-up will be 
subject to special requirements that both you and your board vendor must keep 
track of.  Another potential problem is that TNV vias which pass through the 
ground plane must have a large enough clearance hole in the ground plane to 
avoid hipot failures at that point.

There is one special case where the requirements of the above paragraph are 
easy to meet.  This would be when the TNV circuits are on the top layer and 
the ground plane is on the bottom layer, with no copper on any of the 
internal layers.  In this case, the entire thickness of the board is 
insulation, which is more than adequate.  However, as soon as you start using 
the inner layers, you must get involved with specifying the layer-to-layer 
dielectric strength.  While the overall thickness of the board is always 
specified, individual board fabricators typically exercise considerable 
freedom in selecting the thickness of the insulation between inner layers. 

In summary, I do not think it is a good idea to extend your ground plane 
under the TNV circuits, but it is technically possible to do so by carefully 
specifying the circuit board stack-up.  Before you resort to this solution, I 
think you should carefully examine the reasons why this seems to be 
necessary, and consider alternative solutions. 


Joe Randolph
Telecom Design Consultant
Randolph Telecom, Inc.
http://www.randolph-telecom.com





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