Kester specifically says that rosin residue removal is for cosmetic
considerations. Here's the exact quote:
"Rosin flux residues are non-conductive and non-corrosive. Under normal
circumstances they do not have to be removed from a printed circuit
assembly. Rosin residue removal would be
>The only reason for removing flux is purely cosmetic
That isn't accurate. Even modern no-clean fluxes can cause corrosion and
current leakage if left in place under certain conditions If leakage is a
concern, you can specify a surface resistivity level and the boards can be
ultrasonic washed or
Another problem with cleaning flux is ionic contamination. The
activator in the flux, which is necessary to get the solder to stick, is
acidic. As long as the flux is left alone, the ionic contamination is
trapped in the rosin where it can do no harm. But when you dissolve it
with alcohol
Ted
If the residue is clear, don't bother, you might create more damage than you
realise (ESD). If the residue is brown, you've been using the wrong solder.
If you really feel the desire for aesthetics then you can can brush it with
IPA, but beware ESD if there are sensitive components on
Is there a consensus among builders of the traditional kits (K1, K2, etc)
about the best way to remove solder flux from a completed circuit board?
Some Internet sites recommend acetone, others say isopropyl alcohol. A few
tout their own product without saying exactly what it is. I remember
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