EN 60950 and component heating

1997-09-16 Thread Kevin Harris
Hello All, In testing some product for excessive temperatures I have come up against the following problem. Consider a diode (part of a bridge rectifier circuit) and the PCB underneath the component. If one measures the temperature of the diode it does not come close to the specification for the

RE: EN 60950 and component heating

1997-09-16 Thread DouglasScott
Kevin, Good question. By measuring the pad there are several items to consider. 1st, is the thermocouple in electrical contact with the pad? If so, you may have an incorrect reading caused by currents from the pad through the probe. 2nd, In measuring the pad, you are measuring the junction

re:Re[2]: modeling RFI sources randomness

1997-09-16 Thread Geoffrey Skanes
Moshe: One possible source of the phenomenon you've observed could likely be beating caused by assynchronous clocks. It's even more defined when the frequencies are slightly skewed by an amount slightly less than your receiver bandwidth. Take for example, you have two processors running off

RE: PCB Temperatures

1997-09-16 Thread Peter Tarver
Of equal concern for minor excessive temperatures, is that the bond strength of the copper on the PWB will be the first thing affected. The copper may pull away from the laminate due to thermal stresses and eventually result in high impedance connections. Such poor electrical connections could

Aircraft power

1997-09-16 Thread 102 Schilke, Paul
Hello everyone, Could someone please confirm that all commercial aircraft, world-wide, have North American outlets on board and that the power available at these outlets is 115 Volts at 400Hz. Thanks, Paul Schilke Advance Machine Company pschi...@advmac.com

Re: EN 60950 and component heating

1997-09-16 Thread Mark Hone
To add to Art Michael's ways used to work around the problem of PCBs getting too hot, if the heat is being radiated (rather than conducted through the leads) from the component to the PCB, put a shiny reflective surface on the PCB (self adhesive aluminium foil, or just an area of copper on the

RE: EN 60950 and component heating

1997-09-16 Thread jeichner
We run into this quite often, and yes, I do consider the PCB measurement to be a valid measurement of the PCB temperature whether you are on a pad, a trace, or laminate. My experience with agencies is that they agree, and will allow (for example) a power resistor to be as hot as it's

RE: EN 60950 and component heating

1997-09-16 Thread Farnsworth,Heber
Good point. Local heating can damage a board locally. Although people often do not test the way you indicate, I've seen several failures due to long-term heat aging of the board under a hot component. Some things I've done: 1. Space the component body off the board and/or use longer leads to

Re[5]: modeling RFI sources randomness

1997-09-16 Thread Jon Bertrand
How about another test case: A radio transmitter - carrier only. Turn it on. Then measure the RF output at my local test site. Does the spectrum analyzer report a constant/consistent amount? Seems to me we'd need to define fixed emission

Re: EN 60950 and component heating

1997-09-16 Thread Art Michael
Hello Kevin, This is not an uncommon problem as you have probably guessed. Rather than get embroiled in discussing the details of what one should measure, I'd rather offer a couple of ways I've seen used to work around the problem. A) Assuming you are using leaded diodes; Raise the diode off of

Re[2]: modeling RFI sources randomness

1997-09-16 Thread Moshe_Valdman
I understand what you mean, but I'm not sure this is the whole story. I often check a product which is in idle mode, i.e. the processor is running in a tight loop, repeating itself every X microseconds (which is probably less than the measurement equipment integration time). In this situation

Re[2]: modeling RFI sources randomness

1997-09-16 Thread Moshe_Valdman
I understand what you mean, but I'm not sure this is the whole story. I often check a product which is in idle mode, i.e. the processor is running in a tight loop, repeating itself every X microseconds (which is probably less than the measurement equipment integration time). In this situation