Re: [PEDA] Complex Selection

2001-07-18 Thread Kirk Haderlie

After Looking closer at the issue, I realized I have polygon fills in the
selection that cross the center of all the component pads.  When clicking on
the center of a pad I was not selecting the pad but the polygon fill, thus
my anchor point was the polygon fill.  If I use a via placed in the polygon
fill I was able to move on grid.  I appear that a polygon fill has selection
priority over a component pad.

-Original Message-
From: Kirk Haderlie [mailto:[EMAIL PROTECTED]]
Sent: Tuesday, July 17, 2001 5:40 PM
To: Protel EDA Forum (E-mail)
Subject: [PEDA] Complex Selection


I am trying to move a set of components as a complex selection.  How can I
chose a pad of one of the component for my anchor point during the move?  I
would like to do this so all component pin 1's stay on grid.  I get a box
around the selection and my anchor point for the move is the bottom left
corner of the box, thus my components end up being moved off grid.  Any help
would be appreciated.

Kirk Haderlie
Design Engineer
Vivid Image Technology
[EMAIL PROTECTED]

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[PEDA] Complex Selection

2001-07-17 Thread Kirk Haderlie

I am trying to move a set of components as a complex selection.  How can I
chose a pad of one of the component for my anchor point during the move?  I
would like to do this so all component pin 1's stay on grid.  I get a box
around the selection and my anchor point for the move is the bottom left
corner of the box, thus my components end up being moved off grid.  Any help
would be appreciated.

Kirk Haderlie
Design Engineer
Vivid Image Technology
[EMAIL PROTECTED]

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[PEDA] Fills marked Keepout

2001-05-07 Thread Kirk Haderlie

I placed fills on an internal plane and checked the keepout box.  I assumed
that the keepout woulds void the copper on the internal plane when gerbers
were created. It did not.  Is there a way to apply the keepouts to gerbers
or are keepouts only used for DRC?  If so what is the proper way to void the
copper on the internal plane?

Kirk Haderlie
[EMAIL PROTECTED]
Vivid Image Engineering



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Re: [PEDA] [PROTEL EDA USERS]: Relief on Vias

2001-05-07 Thread Kirk Haderlie

I should clarify the issue.  The problem is that we are using two GND planes
and GND polygon fills top and bottom.  Soldering GND pads is very
difficult(soldering iron stick to the pad), because you effectively have to
heat four planes.  Our thinking was that if we could reduce the thermal
coupling on the polygon fills, soldering might be a little easier.  I think
our solution will be a design rule turning off all thermal relief to pads.
Then we will use vias to stitch the polygon fills to the GND planes.  This
will reduce the thermal coupling on the pads making it easier to solder.

-Original Message-
From: Kirk Haderlie [mailto:[EMAIL PROTECTED]]
Sent: Tuesday, February 20, 2001 8:43 AM
To: Multiple recipients of list proteledausers
Subject: RE: [PROTEL EDA USERS]: Relief on Vias


We are hand soldering the prototypes and having a hard time heating all the
copper attached to the GND vias.  The reliefs on the polygon fill might make
it a little easier to solder.

-Original Message-
From: Dennis Saputelli [mailto:[EMAIL PROTECTED]]
Sent: Monday, February 19, 2001 7:06 PM
To: Multiple recipients of list proteledausers
Subject: Re: [PROTEL EDA USERS]: Relief on Vias


I think that's just the way it is
you can do a convert to pads and rebuild
but why do you want it that way?
Dennis Saputelli

Kirk Haderlie wrote:
> 
> We do a ground polygon fill on the top and bottom of our boards.  Has
anyone
> been successful getting relief connections on vias?  I have tried a
polygon
> connect style design rule that applied only to vias on the GND net but
this
> does not work.
> 
> Kirk Haderlie
> Design Engineer
> Vivid Image Technology
> [EMAIL PROTECTED]
> 
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-- 
___
www.integratedcontrolsinc.comIntegrated Controls, Inc.
   tel: 415-647-04802851 21st Street  
  fax: 415-647-3003San Francisco, CA 94110



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Re: [PEDA] [PROTEL EDA USERS]: Relief on Vias

2001-05-07 Thread Kirk Haderlie

We are hand soldering the prototypes and having a hard time heating all the
copper attached to the GND vias.  The reliefs on the polygon fill might make
it a little easier to solder.

-Original Message-
From: Dennis Saputelli [mailto:[EMAIL PROTECTED]]
Sent: Monday, February 19, 2001 7:06 PM
To: Multiple recipients of list proteledausers
Subject: Re: [PROTEL EDA USERS]: Relief on Vias


I think that's just the way it is
you can do a convert to pads and rebuild
but why do you want it that way?
Dennis Saputelli

Kirk Haderlie wrote:
> 
> We do a ground polygon fill on the top and bottom of our boards.  Has
anyone
> been successful getting relief connections on vias?  I have tried a
polygon
> connect style design rule that applied only to vias on the GND net but
this
> does not work.
> 
> Kirk Haderlie
> Design Engineer
> Vivid Image Technology
> [EMAIL PROTECTED]
> 
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-- 
___
www.integratedcontrolsinc.comIntegrated Controls, Inc.
   tel: 415-647-04802851 21st Street  
  fax: 415-647-3003San Francisco, CA 94110



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[PEDA] [PROTEL EDA USERS]: Relief on Vias

2001-05-07 Thread Kirk Haderlie

We do a ground polygon fill on the top and bottom of our boards.  Has anyone
been successful getting relief connections on vias?  I have tried a polygon
connect style design rule that applied only to vias on the GND net but this
does not work.

Kirk Haderlie
Design Engineer
Vivid Image Technology
[EMAIL PROTECTED]



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