I should clarify the issue.  The problem is that we are using two GND planes
and GND polygon fills top and bottom.  Soldering GND pads is very
difficult(soldering iron stick to the pad), because you effectively have to
heat four planes.  Our thinking was that if we could reduce the thermal
coupling on the polygon fills, soldering might be a little easier.  I think
our solution will be a design rule turning off all thermal relief to pads.
Then we will use vias to stitch the polygon fills to the GND planes.  This
will reduce the thermal coupling on the pads making it easier to solder.

-----Original Message-----
From: Kirk Haderlie [mailto:[EMAIL PROTECTED]]
Sent: Tuesday, February 20, 2001 8:43 AM
To: Multiple recipients of list proteledausers
Subject: RE: [PROTEL EDA USERS]: Relief on Vias


We are hand soldering the prototypes and having a hard time heating all the
copper attached to the GND vias.  The reliefs on the polygon fill might make
it a little easier to solder.

-----Original Message-----
From: Dennis Saputelli [mailto:[EMAIL PROTECTED]]
Sent: Monday, February 19, 2001 7:06 PM
To: Multiple recipients of list proteledausers
Subject: Re: [PROTEL EDA USERS]: Relief on Vias


I think that's just the way it is
you can do a convert to pads and rebuild
but why do you want it that way?
Dennis Saputelli

Kirk Haderlie wrote:
> 
> We do a ground polygon fill on the top and bottom of our boards.  Has
anyone
> been successful getting relief connections on vias?  I have tried a
polygon
> connect style design rule that applied only to vias on the GND net but
this
> does not work.
> 
> Kirk Haderlie
> Design Engineer
> Vivid Image Technology
> [EMAIL PROTECTED]
> 
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