Can get I a few opinions about how you guys handle BGA components in your
layouts?
Do you generally tent (using tenting in Protel99SE via properties) the
dog-bone vias that branch off of each BGA pad to prevent solder thieving or
specify in your specifications to Plug top side vias. There may be
re SE99
we tent them
you want to do this to improve yield
then place free pads on bottom side soldermask to allow probing
generally i think plugging is to be avoided for various reasons
(assuming by 'plugging' we are referring to put some material in the
hole)
in DXP you can make top and
