We are hand soldering the prototypes and having a hard time heating all the
copper attached to the GND vias. The reliefs on the polygon fill might make
it a little easier to solder.
-----Original Message-----
From: Dennis Saputelli [mailto:[EMAIL PROTECTED]]
Sent: Monday, February 19, 2001 7:06 PM
To: Multiple recipients of list proteledausers
Subject: Re: [PROTEL EDA USERS]: Relief on Vias
I think that's just the way it is
you can do a convert to pads and rebuild
but why do you want it that way?
Dennis Saputelli
Kirk Haderlie wrote:
>
> We do a ground polygon fill on the top and bottom of our boards. Has
anyone
> been successful getting relief connections on vias? I have tried a
polygon
> connect style design rule that applied only to vias on the GND net but
this
> does not work.
>
> Kirk Haderlie
> Design Engineer
> Vivid Image Technology
> [EMAIL PROTECTED]
>
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