Re: [PEDA] How to set component library properties in inner layers

2003-09-03 Thread Abd ul-Rahman Lomax
At 01:29 AM 9/3/2003, Website Visitor wrote:

I am currently doing a project on Embedded Passives. Does anyone know how 
do I define the component property so that I can place the comp in inner 
layer? As for now I could only place the comps on top or bottom side. Thanks.
Posted from Association web site by: Aiza
As Mr. Wilson wrote, Protel components are classified as Top and Bottom, no 
other choices. But, yes, you can place pads on inner layers. So you'd make 
a footprint that had its pads on whatever layer you desired.

You could, I suppose, simply edit a component to move the pads to an inner 
layer (by unlocking the primitives for the footprint), but I'd recommend 
against it. Instead, make a footprint and give it a distinctive name, like 
"LAYER 3 CAP". You can also have assembly text and outlines on a mech layer 
dedicated -- and named -- to be your assembly layer for the layer 
containing the passives.

Because the Pick and Place CAM output will give the footprint name, it will 
be easy to separate those parts out from the Pick and Place file to make a 
Pick and Place file just for the embedded passive layer (and keep them out 
of the file for the Top layer, assuming that this is what has been used for 
the layer assignment).



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Re: [PEDA] How to set component library properties in inner layers

2003-09-03 Thread Ian Wilson
On 03:29 PM 3/09/2003, Website Visitor said:
Hi,

I am currently doing a project on Embedded Passives. Does anyone know how 
do I define the component property so that I can place the comp in inner 
layer? As for now I could only place the comps on top or bottom side. Thanks.
I think this will prove to be difficult in Protel.  Components can only 
exist on top and bottom layers.  Assuming you are using both external 
component layers as well as wanting to use embedded passives, I can't see 
an easy solution.

Maybe you could make up components that were labelled as being on the top 
layer for instance, but had tracks and pads on the inner layers - I hve 
never tried it but maybe it could work. You would have to set up specific 
components for each layer (or unlock component primitives  and move the 
copper details to the required layer during routing.)  You would also have 
to twiddle the placement info to pull the embedded stuff out of the outer 
layer placement info.  Also, I am not sure how you would deal with 
component clearance DRC errors (you would probably have to check carefully 
manually and simply not run this DRC check).

It is an issue that may need to be addressed by future CAD packages if 
embedded devices really catch on.

Ian



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