); SAEximRunCond expanded to false Errors-To: [EMAIL PROTECTED] In a message dated 7/26/2007 01:28:55 Pacific Daylight Time, [EMAIL PROTECTED] writes:
>sy cooling flange. On another board we glued a nut to the top of the BGA >and hanged 50-70 kg of it and while the board was clearly bent the BGA was >still firmly hooked to it. Now that's the difference between a few um of gold >too much or not. >There are other cases where the gold-plating is not an issue. >This has been covered in public sources, so a dig around would give some >indication. >Cheers, >Magnus Hi Magnus, I've had a board with what the manufacturer called "black pad" syndrom: the BGA literally popped off by just bending the PCB sufficiently. The solder joint was useless. Is this caused by the problem you described? Also, what do you think is a better process: gold-flash, or gold-immersion? bye, Said ************************************** Get a sneak peek of the all-new AOL at http://discover.aol.com/memed/aolcom30tour _______________________________________________ time-nuts mailing list -- time-nuts@febo.com To unsubscribe, go to https://www.febo.com/cgi-bin/mailman/listinfo/time-nuts and follow the instructions there.