); SAEximRunCond expanded to false Errors-To: [EMAIL PROTECTED] RETRY From: [EMAIL PROTECTED] Subject: Re: [time-nuts] HP 5370B low frequency modulation Date: Thu, 26 Jul 2007 14:51:27 EDT Message-ID: <[EMAIL PROTECTED]>
Said, > Hi Magnus, > > I've had a board with what the manufacturer called "black pad" syndrom: the > BGA literally popped off by just bending the PCB sufficiently. The solder > joint was useless. > > Is this caused by the problem you described? It is the only reason I know if you use a propper soldering profile while soldering the BGA. > Also, what do you think is a better process: gold-flash, or gold-immersion? No preference. The important thing is the relative amount of gold, and that relates to the thickness of gold. A good process on gold-plating is crutial regardless of method. Cheers, Magnus _______________________________________________ time-nuts mailing list -- [email protected] To unsubscribe, go to https://www.febo.com/cgi-bin/mailman/listinfo/time-nuts and follow the instructions there.
