Hi Joe, Nope, Magnus is talking about foam insulated hermetically sealed ocxo's.
The point you are missing is the preheater is only set for a temperature that the foam, etc. can take on a continuous basis... such as +105C. This preheat reduces the amount of additional heat that must be added to make the solder melt. The net result is usually so nice that you cannot even tell the foam has even been heated. -Chuck Harris > > I think we are talking about different things. For getting chips off a > big multilayer board, preheat plus hot air is a standard way to go, but we > are talking about how to unsolder a steel can with foam insulation within. > Slow heating to near soldering temperature is likely to yield a heap of > goo. > > The point of the torch method is to heat the can's solder seam up *fast*, > so the solder melts before the foam. > > Joe > > _______________________________________________ > time-nuts mailing list -- [email protected] > To unsubscribe, go to https://www.febo.com/cgi-bin/mailman/listinfo/time-nuts > and follow the instructions there. > _______________________________________________ time-nuts mailing list -- [email protected] To unsubscribe, go to https://www.febo.com/cgi-bin/mailman/listinfo/time-nuts and follow the instructions there.
