Bob Camp wrote:
Hi
I certainly agree that, say potting the circuit board, would be a lot easier than some of the stuff we have been talking about.
I am not sure that it would significantly improve the case.
The physical package as a whole, needs temperature stabilization.
Double-oven strategies etc. is among them. At the same time it is a heat
source, so we need to cool a few wats off it. Except for possibly the
resonant cavity, I don't think thermal gradients is as important as
stable temperature, where as the crystal(s) of the electronics boards is
another story. The electronics might enjoy a cooler and somewhat
gradient free environment, but for longer taus most of the effects would
be servoed in to the rubidium resonance anyway, so I suspect most of
those long-term effects can be focused on the physical package.
My main concern about tearing up the unit is impacting the magnetic shielding.
I assume that the outer enclosure forms part of the magnetic shield (at least
that's what the data sheets say ...).
Good point.
Cheers,
Magnus
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