On 25/07/12 23:10, Bob Camp wrote:
Hi

That's just a basic solder sealed package. It should be pretty easy to pop 
open. You'll use up a bit of solder wick doing it…

I'm still sort-of hoping someone with experience will offer but I'm leaning towards having a go at some point.

My natural reaction would be that solder wick will never clear the solder which has been sucked deep into the joint by capillary action. The case/base look to be a pretty tight fit even without the solder.

Is it possible to clear all the solder just with solder wick or do you have some technique to get the last bit out? Do you ultimately need to heat the whole of the length of the seam simultaneously to get it apart?

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