Am 16.01.2016 um 15:03 schrieb Bob Camp:
Unlike the world of lithography, the dicing process has not made a lot of
progress.
Decades ago a 1mm x 1 mm die was about as small as you could get. From what
I can see that has not dropped by more than a factor of two in 40 years (if at
all).
Yes, there’s a lot more to it than just a dicing saw. Things like bond wire
attach
also figure in. It still takes a certain size bond wire to carry a practical
amount
of current …
The net result *could* be a process that does a gate or function in < 1% of
the available
area. Everything else is just empty space along for the ride (or to provide
attach
points).
Already 30 years ago when I took my chip design lessons, there
were chips that were pad-bound. If they had, say, 14 Pins, there
was no point to compress everything together since the pad
locations and the bonding dictated the minimum chip size.
regards, Gerhard
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