Hi > On Apr 7, 2017, at 7:19 PM, jimlux <[email protected]> wrote: > > On 4/7/17 3:45 PM, Charles Steinmetz wrote: >> Bob wrote: >> >>> The epoxy over wire bond construction approach >>> is low cost, and not very experimenter friendly. >> >> It is also extremely unreliable, particularly WRT environmental effects >> such as temperature changes, humidity, and atmospheric pollutants. In >> my view, it is unsuitable for use in anything but dirt cheap, purely >> disposable devices like greeting-card audio players and disposable cameras. >> > > Interestingly enough it *is* used in space flight hardware.
Humidity does not tend to be a big issue once you get in space :) Bob > It is much less expensive, lighter weight and easier to inspect than thick > film hybrids and similar schemes. > > You can can do a pre-cap inspection, then apply the potting material, and > then you could even xray it to see if the bond wires moved or something. > > A flipchip with a blob is even better. > > It's even reworkable (e.g. you can soften the blob & solder and scrape the > die off and bond a new one down). > > I suspect that there is a wide variation in the material you blob on there > and so forth. > > > > > > > _______________________________________________ > time-nuts mailing list -- [email protected] > To unsubscribe, go to https://www.febo.com/cgi-bin/mailman/listinfo/time-nuts > and follow the instructions there. _______________________________________________ time-nuts mailing list -- [email protected] To unsubscribe, go to https://www.febo.com/cgi-bin/mailman/listinfo/time-nuts and follow the instructions there.
