On Fri, 21 Apr 2023 at 06:32, Neha Malcom Francis <[email protected]> wrote: > > By providing entries in the binman node of the device tree, binman will > be able to find and package board config artifacts generated by > TIBoardConfig with sysfw.bin and generate the final image sysfw.itb. > It will also pick out the R5 SPL and sign it with the help of TI signing > entry and generate the final tiboot3.bin. > > Entries for A72 build have been added to k3-j721e-binman.dtsi to > generate tispl.bin and u-boot.img. > > Support has been added for both HS-SE(SR 1.1), HS-FS(SR 2.0) and GP images > In HS-SE, the encrypted system firmware binary must be signed along with > the signed certificate binary. > > tiboot3.bin and sysfw-j721e_sr1_1-hs.itb: For HS-SE devices > tiboot3.bin_fs and sysfw-j721e_sr2-hs-fs.itb: For HS-FS devices > tiboot3.bin_unsigned and sysfw-j721e-gp-evm.itb: For GP devices > <filename>.bin/img: For HS devices > <filename>.bin_unsigned/img_unsigned: For GP devices > > Intention of patch is to move signing and packaging to binman, > thus making makefile target only if binman is not enabled. > > It is to be noted that the bootflow followed by J721E requires: > > tiboot3.bin: > * R5 SPL > * R5 SPL dtbs > > sysfw.itb: > * TIFS > * board-cfg > * pm-cfg > * sec-cfg > * rm-cfg > > tispl.bin: > * DM > * ATF > * OPTEE > * A72 SPL > * A72 SPL dtbs > > u-boot.img: > * A72 U-Boot > * A72 U-Boot dtbs > > Signed-off-by: Neha Malcom Francis <[email protected]> > --- > arch/arm/dts/k3-j721e-binman.dtsi | 732 ++++++++++++++++++ > .../k3-j721e-common-proc-board-u-boot.dtsi | 1 + > .../arm/dts/k3-j721e-r5-common-proc-board.dts | 1 + > arch/arm/mach-k3/config.mk | 4 + > board/ti/j721e/Kconfig | 2 + > scripts/Makefile.spl | 2 + > 6 files changed, 742 insertions(+) > create mode 100644 arch/arm/dts/k3-j721e-binman.dtsi
Reviewed-by: Simon Glass <[email protected]> Wow this is complicated!
