--- crowd-funded eco-conscious hardware: https://www.crowdsupply.com/eoma68
On Fri, Dec 22, 2017 at 10:32 PM, Richard Wilbur <[email protected]> wrote: > Here's another view of the connector end with some slight revisions of > the ground fill and keepout boundaries between the ESD and connector > components. > > Summary: > > 1. I moved the East extent of the layer 3 ground fill east to the > edge of the connector pads. ok remember that ground flood-fill is the entire layer 3, i'm not creating a *specific* area for ground "fill", it's done by default according to the (specified) design rules. with the new "conditional" rule added, layer 3 now looks like this: http://hands.com/~lkcl/eoma/a20/275_hdmi/layer3.jpg so there's a few things i need to sort out, which i'll get to: main reason for showing that image is: the clearance to the VIAs has also extended to 15mil now. i believe it's not so much the vias though as the tracks connected *to* the vias. if there has to be a 5 mil clearance to those i can... maybe sort something out :) > 2. The layer 2 ground keepout remains open under the high-frequency > pads of both the ESD component and the connector. ok cool. > 3. The layer 2,3,4 ground keepout West edge moved with the East edge > of the layer 3 ground fill to the edge of the connector pads. oh wait... i haven't put in a keepout *at all* on layers 3 and 4. you think it would be best to punch the hole *right* down so that it's only layer 5 providing a GND plane for both sides? it makes sense, i just want to confirm. > Thanks for the images and video, Luke. ehn the vides are fun :) l. _______________________________________________ arm-netbook mailing list [email protected] http://lists.phcomp.co.uk/mailman/listinfo/arm-netbook Send large attachments to [email protected]
