On Dec 22, 2017, at 20:38, Luke Kenneth Casson Leighton <[email protected]> wrote: > On Fri, Dec 22, 2017 at 10:32 PM, Richard Wilbur > <[email protected]> wrote: >> Here's another view of the connector end with some slight revisions of >> the ground fill and keepout boundaries between the ESD and connector >> components. >> >> Summary: >> >> 1. I moved the East extent of the layer 3 ground fill east to the >> edge of the connector pads. > > ok remember that ground flood-fill is the entire layer 3, i'm not > creating a *specific* area for ground "fill", it's done by default > according to the (specified) design rules. with the new "conditional" > rule added, layer 3 now looks like this: > http://hands.com/~lkcl/eoma/a20/275_hdmi/layer3.jpg > > so there's a few things i need to sort out, which i'll get to: main > reason for showing that image is: the clearance to the VIAs has also > extended to 15mil now. i believe it's not so much the vias though as > the tracks connected *to* the vias. if there has to be a 5 mil > clearance to those i can... maybe sort something out :)
15mil clearance to HDMI nets and vias won't hurt anybody's feelings! Looks good (minus the keepout under the connector). […] >> 3. The layer 2,3,4 ground keepout West edge moved with the East edge >> of the layer 3 ground fill to the edge of the connector pads. > > oh wait... i haven't put in a keepout *at all* on layers 3 and 4. > you think it would be best to punch the hole *right* down so that it's > only layer 5 providing a GND plane for both sides? it makes sense, i > just want to confirm. Yes, that is what I was asking for under the high-frequency differential signals at the connector. If you have reservations about it, let me know. I'm happy to get feedback from another perspective. _______________________________________________ arm-netbook mailing list [email protected] http://lists.phcomp.co.uk/mailman/listinfo/arm-netbook Send large attachments to [email protected]
