Thanks again for the pictures and the video.
Concerning the keepouts under the connector:
1. At the north boundary I would pull the edge up a little further north away
from the northwestern differential pair.
2. At the west boundary I see your point regarding layers 4 and 5. Looks like
you have made a good solution. I suppose you could add 5mil additional
overlap. How much overlap does it currently have? How much opening from the
edge of the keepout on layer 4 to the edge of the closest connector pads?
I would vote to keep the layer 5 holes under the layer 6 ESD pads for the same
reason we added them to layer 2 for the ESD pads on layer 1.
Some of the adjustments on layer 6 might be taken care of by modifying the net
groups to create an "HDMI High-Frequency" group which contains only the
differential pairs {HTX2P, HTX2N, HTX1P, HTX1N, HTX0P, HTX0N, HTXCP, HTXCN},
apply the 15mil conditional clearance rule to that group. Then see what issues
remain.
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