I don't know of anyone who's actually done this, but we do also have a passive-cooled concept for our new digitiser board (loosely based on ROACH2). We've been thinking about a prototype that'd essentially be turning a ROACH2 board upside-down and bolting it onto a giant metal plate that's been appropriately milled out of a solid chunk of alu. The FPGA, PPC, QDR and other hot bits would make contact with the plate and use it as heatsink. The other high-profile parts (RAM DIMM, for example) needs holes or cavities milled out the alu.
I think Vaughan (cc'd here) might have some mechanical drawings of ROACH2 with the holes and things in the appropriate place. It might help you get started. He could also provide some CFD models and heat load measurements of the various components. Jason Manley DSP Specialist SKA-SA Cell: +27 82 662 7726 Work: +27 21 506 7300 On 15 Apr 2013, at 20:29, Brad Dober wrote: > Dear Casper Collaboration Members, > > My name is Brad Dober, and I'm a grad student at UPenn working on a > ROACH-based MKID readout for a balloon payload. At our float altitude, > air-cooling the ROACH and ADC/DACs isn't feasible Has any other group looked > into or even designed a conduction-cooled system for .either the ROACH1 or > ROACH2? > > Any leads would be extremely helpful. > > Sincerely, > > Brad Dober > Ph.D. Candidate > Department of Physics and Astronomy > University of Pennsylvania > Cell: 262-949-4668
