Heatpipes and dunking <http://www.pugetsystems.com/submerged.php>in liquid (e.g. mineral oil) are options we've explored (with PCs), although we seem to be favoring pressure vessels at this point.
Steve On Tue, Apr 16, 2013 at 2:34 AM, Jason Manley <[email protected]> wrote: > I don't know of anyone who's actually done this, but we do also have a > passive-cooled concept for our new digitiser board (loosely based on > ROACH2). We've been thinking about a prototype that'd essentially be > turning a ROACH2 board upside-down and bolting it onto a giant metal plate > that's been appropriately milled out of a solid chunk of alu. The FPGA, > PPC, QDR and other hot bits would make contact with the plate and use it as > heatsink. The other high-profile parts (RAM DIMM, for example) needs holes > or cavities milled out the alu. > > I think Vaughan (cc'd here) might have some mechanical drawings of ROACH2 > with the holes and things in the appropriate place. It might help you get > started. He could also provide some CFD models and heat load measurements > of the various components. > > Jason Manley > DSP Specialist > SKA-SA > > Cell: +27 82 662 7726 > Work: +27 21 506 7300 > > On 15 Apr 2013, at 20:29, Brad Dober wrote: > > > Dear Casper Collaboration Members, > > > > My name is Brad Dober, and I'm a grad student at UPenn working on a > ROACH-based MKID readout for a balloon payload. At our float altitude, > air-cooling the ROACH and ADC/DACs isn't feasible Has any other group > looked into or even designed a conduction-cooled system for .either the > ROACH1 or ROACH2? > > > > Any leads would be extremely helpful. > > > > Sincerely, > > > > Brad Dober > > Ph.D. Candidate > > Department of Physics and Astronomy > > University of Pennsylvania > > Cell: 262-949-4668 > > >
