> Merely dunking things in liquid will just get you hot liquid. And I'd be > concerned > about the chip packages' leak integrity.
Excellent point. In fact, the Xilinx packages have breather holes that prevent us from washing the boards after manufacture. So I'd be very nervous about this. > My point is, don't forget the radiator. Then ask, perhaps, "Can I just > attach the > chips to the radiator?". Perhaps this is already what Jason is getting at, > but he > didn't say how his "heatsink" was going to dispose of the heat. Yeah, big fins on the other side of the alu! You'd have to run the numbers to see how big and how many fins you'd need at altitude/thin air. Jason
