Hello,

Not sure I like the case to ground layer connection unless the ground layer
is very well bonded to mains earth.
If it isn't, then you're going to get currents flowing and voltages flying
in your ground.

When equipment is housed in a metallic enclosure this itself can be used to
guide the ESD current around the internal circuitry, provided that it is
properly constructed!.
A poorly-built enclosure can actually enhance ESD coupling to the circuit
within.
Apertures or seams in the enclosure will act as high-impedance barriers to
the current and transient fields will occur around them, so they must be
minimised. All metalic covers and panels must be bonded together with a low
impedance connection (<2.5 milli-ohms at DC) in at least two places; long
panel-to-panel "bonding" wires must be avoided since they radiate high
fields during an ESD event. I/O cables and internal wiring may provide
low-imp. paths for the current, in the same way as they are routes into and
out of the equipment for common-mode RF interferance. The best way to
eliminate susceptibility of internal harnesses and cables is not to have
any, through economical design of the board interconnections. External
cables must have their shields WELL decoupled to the ground structure (i.e.
360 degree bonding of cable screens to connector backshell and no pigtails!.
Insulated enclosures make the control of ESD currents harder to achieve, and
a well designed and low inductance circuit ground is essential. But, if the
enclosure can be to designed to have no apertures which provide air gap
paths to the interior then no direct discharge will be able to occur,
provided the material's dielectric strength is high enough. 

ESD waveforms are usually in the sub-nanosecond region.

1. Keep all external interfaces physically near each other
2. filter all interfaces to ground at their point of entry
3. if this is not possible, isolate susceptible interfaces with common-mode
ferrite choke or opto-couplers
4. use screened cable with the screen connected directly to gnd
5. screen pcbs from exposed metalwork or external discharge points with
extra internally grounded plates


* breath * !!!


For reduced ESD susceptibility, circuit ground needs to remain stable during
an ESD event. A low inductance ground network is essential, but this must
also be coupled (by caps. or directly) to a master referance ground
structure.



Kind regards, 
Darren Logan BSc(Hons) 
Development Engineer 
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-----Original Message-----
Sent: 24 July 2003 13:39
To: Multiple recipients of list CHIPDIR-L


On Thu, Jul 24, 2003 at 04:10:39AM -0800, Elbert Smit wrote:

> > Where abouts are you applying the ESD? (case, window etc.?)
> 
> Metal part of the housing, no earthing available. 

Are all metallic parts (of the housing and other parts) connected together?
If not you will have some sparks at overlapping positions and more
problems...

>- The metal part is connected to the ground layer of the PCB

Is there one connection or more than one? You can have currents through
the PCB layer that create high voltages in other wires...

>- The PCB contains a transzorb like component (one direction)
 
Is it fast enough? Maybe 10�s are too slow. 

        Matthias
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