That's an interesting document Josh. It summarizes, "Solder connection temperature, not soldering iron tip temperature, should be the parameter we focus on to ensure reliable solder joints."
That's why the proper tip geometry and a small amount of solder to conduct the heat efficiently is so important for consistent, properly soldered joints. Still, a certain amount of time is required for the solder and surfaces to reach the proper temperature and allow the solder to flow as the document explains. I believe that's what Don is referring to with his 2 s or 3 s soldering time range for the typical components and solder sizes we are using on the Elecraft and similar gear. That interval is what is required by the thermal mass of the parts more than by a droop in the iron temperature. I've always found it a good "rule of thumb". I submit it is still valid even with a new technology iron such as described in the document. The difference is that the newer more sensitive temperature controls require little or no adjustment of their heat setting when changing from one size solder joint to another (within limits) or when soldering a great many joints in rapid succession. 73, Ron AC7AC ______________________________________________________________ Elecraft mailing list Home: http://mailman.qth.net/mailman/listinfo/elecraft Help: http://mailman.qth.net/mmfaq.htm Post: mailto:[email protected] This list hosted by: http://www.qsl.net Please help support this email list: http://www.qsl.net/donate.html Message delivered to [email protected]
